Domestic semiconductor producer SMIC advances toward self-sufficiency in wafer fabrication equipment with the trial of its inaugural homegrown immersion DUV lithography tool.
Shanghai, China - Semiconductor Manufacturing International Corporation (SMIC), the largest Chinese foundry, is currently testing a domestic immersion DUV lithography tool developed by Shanghai Yuliangsheng Technology Co., a company based in Shanghai, China. This tool, codenamed 'Mount Everest', is a significant step towards localising China's semiconductor supply chain.
The Yuliangsheng tool, designed for 28nm-class fabrication technologies, resembles ASML's Twinscan NXT:1950i from 2008, which was designed for 32nm-class process technology in one exposure. However, it is unclear whether the Yuliangsheng tool is being used in SMIC's production flow or if it is still in the testing phase. If in the testing phase, the scanner is years away from mass-producing actual chips.
SMIC aims to integrate domestic immersion DUV lithography machines into production lines starting in 2027, after their qualification. Before that, they will continue to rely on tools from ASML. Shanghai Yuliangsheng Technology Co.'s tool is not expected to contribute to SMIC's sub-10nm fabrication processes before 2030.
The maturation and integration of the Yuliangsheng tool into SMIC's 28nm flow is expected in 2027. The tool predominantly uses components sourced within China, but some parts are still imported. The company is working to localize the entire supply chain for the tool.
Shanghai Yuliangsheng Technology Co. and SiCarrier, another entity, are reportedly affiliated, working towards the same goal. SiCarrier, known for calling its WFE projects after mountains, similarly labels its projects. This suggests a shared vision and collaboration between the two companies.
The U.S. Department of Commerce has listed Shanghai Yuliangsheng Technology Co. on its Entity List, a move that could potentially impact the company's operations and partnerships. Once the supply chain is localized, China could operate outside the influence of U.S. or European export policies in this segment of chip production.
ASML, a Dutch company, has developed NXT:2000i for 7nm and 5nm-class nodes, which is generations ahead of the NXT:1950i. The Yuliangsheng tool, while designed for 28nm-class fabrication technologies, is expected to take years for significant redesign to reach 16nm, 7nm, or potentially 5nm fabrication nodes.
The tool's codename, 'Mount Everest', may highlight the importance of the project. If successful, it could significantly reduce China's reliance on foreign technology and strengthen its position in the global semiconductor industry. However, the timeline and outcomes remain uncertain, as the tool is still in the testing phase.
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