Next-Generation Flexible Connectivity Solutions: QMC Modules Unveiled
In a groundbreaking development, the VITA 93 QMC standard has been introduced, offering a robust and flexible solution for rugged peripheral expansion, particularly in military, avionics, commercial, and industrial applications.
The VITA 93 QMC modules, approximately the size of an M.2 module, are designed to withstand harsh environmental conditions, including shock and vibration. These modules are ideal for use in aerospace, defense, and industrial automation sectors, where size, weight, and power constraints are common.
Mark Littlefield, Director of Systems Products at Elma Electronic, introduced the VITA 93 QMC standard at this year's Embedded Tech Trends conference. The standard does not specify the use of any particular carrier boards, providing manufacturers with the flexibility to design solutions tailored to their specific needs.
The connectors used in VITA 93 QMC modules are Samtec's AcceleRate HD Ultra-Dense, Slim Body Arrays with a 0.635-mm pitch. These connectors are designed to handle high-speed serial interfaces like PCI Express Gen 6, and are rated up to 64-Gb/s PAM4.
One of the key advantages of VITA 93 QMC modules is their scalability. They can be x1, x2, x3, and x4 wide, with each larger version adding more sockets for increased bandwidth. Larger VITA 93 QMC modules can accommodate larger chips such as GPGPUs or artificial-intelligence (AI) accelerators.
In military and avionics applications, VITA 93 QMC supports ruggedness with conduction cooling and stackable module configurations that fit into constrained and shock-prone environments. In commercial and industrial domains, it provides scalable modular solutions that can be custom designed or integrated on standard carrier boards such as PCIe and OpenVPX, enhancing modularity and flexibility in embedded computing systems.
The VITA 93 QMC standard also addresses issues related to rugged peripheral expansion. Each module has a pair of sockets at each end and four mounting holes, allowing for versatile carrier board configurations. Carrier boards can fit one or more QMC modules, providing a modular and scalable solution.
Furthermore, the VITA 93 QMC standard includes provisions for cooling, with convention cooling as the default and conduction cooling requiring the addition of heatsinks. The modules also feature pins for an IPMI link to handle platform management.
In conclusion, the VITA 93 QMC standard offers a robust, scalable, and flexible solution for rugged peripheral expansion, making it an ideal choice for a wide range of applications in defense, avionics, commercial, and industrial embedded systems.
[1] VITA Technologies, "VITA 93 QMC Rugged Mezzanine Modules," [accessed 2022-04-11]. [2] OpenVPX Technology Association, "VITA 93 QMC Rugged Mezzanine Module," [accessed 2022-04-11]. [3] Samtec, "VITA 93 QMC Rugged Mezzanine Connectors," [accessed 2022-04-11].
The VITA 93 QMC standard, aimed at various applications including military, avionics, commercial, and industrial sectors, leverages advanced technology in data-and-cloud computing by offering a scalable, rugged, and flexible solution for rugged peripheral expansion. This technology is employed in the design of VITA 93 QMC modules, which can accommodate large chips like GPGPUs or AI accelerators and are equipped with high-speed serial interfaces for data processing.
